Description
-Little residue, no need to clean. Excellent solderability.
-High intensity
joint. Good immersion
-No poison or orrosion. No deterioration and not dry.
VGood insulation. Smooth soldering surface.
-Non-corrosive to IC and PCB.
-Stable performance and low volatility.
-No irritating odor, safe and
reliable.
-Strong insulation, smooth soldering surface.
-Suitable for
mobile phone, PC board precision electronic chip level BGA during the soldering
process.
Specification:
-Viscosity: 1(Pa S)
-Granularity: 1(um)
-Neutral
PH: 7. 0.3
-Main Material: Rosin
-Color: Yellow
-Quantity: 1 Pc,
50 G